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Jiangsu Zhongke Kehua New Materials Co., Ltd. ("Zhongke Kehua") was founded in 2011 and is located in Hailing Industrial Park, Taizhou City, Jiangsu Province. Established by Beijing Kehua New Materials Technology Co., Ltd. ("Beijing Kehua"), it is a high-tech enterprise and "Little Giant" enterprise specializing in the R&D, production and sales of epoxy molding compounds, a key semiconductor packaging material.

In 1984, Beijing Kehua was established by the Institute of Chemistry, Chinese Academy of Sciences (CAS) and is committed to the transformation of scientific and technological achievements. It has successively launched more than ten categories of products based on original technologies from the Institute of Chemistry, including domestic 502 glue, cooling masterbatches, and epoxy molding compounds. Beijing Kehua has participated in the national "Seventh Five-Year Plan", "Eighth Five-Year Plan" and "Ninth Five-Year Plan" key research projects on epoxy molding compounds, and undertaken the national "Tenth Five-Year Plan" 863 Program and the sub-project of the "Eleventh Five-Year Plan" Ministry of Science and Technology's Major Special Project 02 in the field of epoxy molding compounds. It has developed into a backbone enterprise in the domestic epoxy molding compound industry. At present, Beijing Kehua has injected all its epoxy molding compound technologies into Zhongke Kehua.

Zhongke Kehua has established R&D centers in Beijing and Taizhou respectively, building a relatively complete R&D platform focusing on the development and application of epoxy molding compound products. The company has gathered a strong R&D team and, with the support of the R&D platform and talent advantages of the Institute of Chemistry, CAS, closely follows the frontiers of semiconductor packaging technology and market demand. It focuses on the development of epoxy molding compounds for high-end application fields such as advanced packaging of high-density integrated circuits, automotive electronics, and third-generation semiconductors. The company has obtained more than 30 authorized invention patents in the field of epoxy molding compounds.

Covering an area of 85 mu, Zhongke Kehua has built 70,000 square meters of workshops and auxiliary facilities, and owns 8 epoxy molding compound production lines, meeting the production needs of medium and high-end epoxy molding compounds. In the future, the company will continue to invest in the construction of high-level epoxy molding compound production lines and continuously improve the automation, informatization and intelligence of the manufacturing process.

In 2022, Zhongke Kehua introduced strategic investment, completed the shareholding system restructuring, and actively laid out the capital market.

Zhongke Kehua is committed to becoming a world-class semiconductor packaging material manufacturing enterprise. As a high-tech company originated from the Chinese Academy of Sciences, we will bravely shoulder our mission, realize the transformation from domestic substitution to innovative development, take a path of semiconductor packaging material development with Chinese characteristics, and contribute to the revitalization of China's semiconductor industry.